Be part of one of the largest career fairs in the nation!
The Engineering Career Fairs completely fill the Hilton Coliseum and Scheman Building each February and September. Face-to-face networking is one of the most effective recruiting methods, so don’t miss the opportunity to network with 4000-7000 great students!
2018 Fall Engineering Career Fair
New this fall: Two career fair dates to offer employers more flexibility!
Both fairs will be a mix of all engineering majors, so choose the date that works best for you! Our students research the companies that come to campus, and they will visit your booth regardless of the day you choose when they find your employment opportunities interesting.
Location: Scheman Building
Time: 12:00 to 5:00p
Location of On-Campus Interviewing on the 19th: Scheman Building*
This fair is the better choice for employers that would prefer a more professional environment than the Lied Recreation Center for conducting their on-campus interviews.
Location: Scheman Building and Hilton Coliseum
Time: 12:00 to 5:00p
Location of On-Campus Interviewing on the 26th: Lied Recreation Center*
This fair is the better choice for employers that will also being attending the Business, Industry and Technology fair.
(*Note: Preference for on-campus interview space on the 19th and 26th will be given to employers traveling over 100 miles to attend the fair. Conducting on-campus interviews on days other than the 19th and 26th is free of charge and will take place in the private meeting rooms in Marston Hall)
2018 Fall Career Fairs Information Sheet – View more information about registration, our booth policy, handling supplies, parking, etc.
Recruiting Tips – Information on making the most of your time at the career fair.
Career Fair Lodging Information – Information on lodging in the Ames area.
On-Campus Interviews – Please note that registering for the career fair does NOT automatically reserve interviewing space for your company. You will need to submit a separate request for interview space through CyHire.