Indian Institute of Technology, Madras, B. Tech., Mechanical Engineering, 2003
Cornell University, MS, Mechanical and Aerospace Engineering, 2006
Cornell University, PhD, Mechanical and Aerospace Engineering, 2008
Computational physics, computational mechanics (fluid mechanics and heat transfer), stochastic analysis, uncertainty quantification and propagation, multiscale modeling, control and optimization of complex systems, materials-by-design, and parallel computing and inverse problems.
B. Ganapathysubramanian, N. Zabaras, Modeling multiscale diffusion processes in random heterogeneous media, Computer Methods in Applied Mechanics and Engineering, 197 (2008) 3560-3573.
N. Zabaras, B. Ganapathysubramanian, A scalable framework for the solution of stochastic inverse problems using a sparse grid collocation approach, Journal of Computational Physics, 227 (2008) 4697-4735.
B. Ganapathysubramanian, N. Zabaras, A non-linear dimension reduction methodology for generating data-driven stochastic input models, Journal of Computational Physics, 227 (2008) 6612-6637.
B. Ganapathysubramanian, N. Zabaras, A seamless approach towards stochastic modeling: Sparse grid collocation and data driven input models, Finite Elements in Analysis and Design, invited paper for the 19th Melosh Competition, 44 (2008) 298-320.
B. Ganapathysubramanian, N. Zabaras, Modeling diffusion in random heterogeneous media: Data-driven models, stochastic collocation and the variational multi-scale method, Journal of Computational Physics, 226 (2007) 326-353.
B. Ganapathysubramanian, N. Zabaras, Sparse grid collocation methods for stochastic natural convection problems, Journal of Computational Physics, 225 (2007) 652-685.
Martin Thuo an assistant professor of materials science and engineering at Iowa State University and an associate of the U.S. Department of Energy’s Ames Laboratory, has led development of liquid-metal particles that can be used for heat-free soldering and other applications. Thuo has helped launch a startup company to develop and market the technology. Read More...